Low Dielectric Constant Materials for IC Applications (Paperback, Softcover reprint of the original 1st ed. 2003)

Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applications in microelectronics. Highly informative contributions from leading academic and industrial laboratories provide comprehensive information about materials technologies for < 0.18 um process technology. Topics include: Organic dielectric materials, Inorganic dielectric materials, Composite dielectric materials, Metrology and characterization techniques, Integration, Reliability. This volume will be an invaluable resource for professionals, scientists, researchers and graduate students involved in dielectric technology development, materials science, polymer science, and semiconductor devices and processing.

General

Imprint:	Springer-Verlag
Country of origin:	Germany
Series:	Springer Series in Advanced Microelectronics, 9
Release date:	December 2012
First published:	2003
Editors:	Paul S. Ho • Jihperng Leu • Wei William Lee
Dimensions:	235 x 155 x 17mm (L x W x T)
Format:	Paperback
Pages:	310
Edition:	Softcover reprint of the original 1st ed. 2003
ISBN-13:	978-3-642-63221-1
Categories:	Books > Professional & Technical > Mechanical engineering & materials > Materials science > Testing of materials > General Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Electronic devices & materials > General
LSN:	3-642-63221-1
Barcode:	9783642632211

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