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Fine Pitch Surface Mount Technology - Quality, Design, and Manufacturing Techniques (Hardcover, 1992 ed.)
Loot Price: R5,911
Discovery Miles 59 110
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Fine Pitch Surface Mount Technology - Quality, Design, and Manufacturing Techniques (Hardcover, 1992 ed.)
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Fine pitch high lead count integrated circuit packages represent a
dramatic change from the conventional methods of assembling
electronic components to a printed interconnect circuit board. To
some, these FPTpackages appear to bean extension of the assembly
technology called surface mount or SMT. Many of us who have spent a
significant amount of time developing the process and design
techniques for these fine pitchpackages haveconcluded that these
techniquesgobeyondthose commonly useed for SMT. In 1987 the
presentauthor, convincedofthe uniqueness ofthe assembly and design
demands ofthese packages, chaired ajoint committee where the
members agreed to use fine pitch technology (FPT) as the defining
term for these demands. The committee was unique in several ways,
one being that it was the first time three U. S. standards
organizations, the IPC (Lincolnwood, IL), theEIA(Washington, D. C.
), and theASTM (Philadelphia), cametogether tocreate standards
before a technology was in high demand. The term fine pitch
technology and its acronym FPT have since become widely accepted in
the electronics industry. The knowledge of the terms and demands of
FPT currently exceed the usage of FPT packaged components, but this
is changing rapidly because of the size, performance, and cost
savings of FPT. I have resisted several past invitations to write
other technical texts. However, I feel there are important
advantages and significant difficulties to be encountered with FP
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