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Advanced Thermal Design of Electronic Equipment (Hardcover)
Loot Price: R5,554
Discovery Miles 55 540
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Advanced Thermal Design of Electronic Equipment (Hardcover)
Expected to ship within 10 - 15 working days
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The field of electronic packaging continues to grow at an amazing
rate. To be successful in this field requires analytical skills, a
foundation in mechanical engineering, and access to the latest
developments in the electronics field. The emphasis for each
project that the electronic packaging engineer faces changes from
project to project, and from company to company, yet some constants
should continue into the foreseeable future. One of these is the
emphasis on ther mal design. Although just a few years ago thermal
analysis of electronic equipment was an afterthought, it is
becoming one of the primary aspects of many packaging jobs. It
seems that the days of just adding a bigger fan to reduce the
overheat ing problem are almost over. Replacing that thought is the
up-front commitment to CFD (Computational Fluid Dynamics) software
code, FEA (Finite Element Analysis) software, and the realization
that the problem will only get worse. As the electronic circuit
size is reduced, speed is increased. As the power of these systems
increases and the volume allowed diminishes, heat flux or density
(heat per unit area, W/m 2 or Btulh ft2) has spiraled. Much of the
improvement in the reliability and packaging density of electronic
circuits can be traced to advances in thermal design. While air
cooling is still used extensively, advanced heat transfer
techniques using exotic synthetic liquids are becoming more
prominent, allowing still smaller systems to be manufactured. The
appli cation of advanced thermal management techniques requires a
background in fluid dynamics."
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