This Encyclopedia comes in 3 sets. To check out Set 1 and Set 3,
please visit Set 1: Thermal Packaging Techniques and Set 3: Thermal
Packaging Applications /remove Thermal and mechanical packaging -
the enabling technologies for the physical implementation of
electronic systems - are responsible for much of the progress in
miniaturization, reliability, and functional density achieved by
electronic, microelectronic, and nanoelectronic products during the
past 50 years. The inherent inefficiency of electronic devices and
their sensitivity to heat have placed thermal packaging on the
critical path of nearly every product development effort in
traditional, as well as emerging, electronic product
categories.Successful thermal packaging is the key differentiator
in electronic products, as diverse as supercomputers and cell
phones, and continues to be of pivotal importance in the refinement
of traditional products and in the development of products for new
applications. The Encyclopedia of Thermal Packaging, compiled in
four multi-volume sets (Set 1: Thermal Packaging Techniques, Set 2:
Thermal Packaging Tools, Set 3: Thermal Packaging Applications, and
Set 4: Thermal Packaging Configurations) will provide a
comprehensive, one-stop treatment of the techniques, tools,
applications, and configurations of electronic thermal packaging.
Each of the author-written sets presents the accumulated wisdom and
shared perspectives of a few luminaries in the thermal management
of electronics.Set 2: Thermal Packaging ToolsThe second set in the
encyclopedia, Thermal Packaging Tools, includes volumes dedicated
to thermal design of data centers, techniques and models for the
design and optimization of heat sinks, the development and use of
reduced-order "compact" thermal models of electronic components, a
database of critical material thermal properties, and a
comprehensive exploration of thermally-informed electronic design.
The numerical and analytical techniques described in these volumes
are among the primary tools used by thermal packaging practitioners
and researchers to accelerate product and system development and
achieve "correct by design" thermal packaging solutions.The four
sets in the Encyclopedia of Thermal Packaging will provide the
novice and student with a complete reference for a quick ascent on
the thermal packaging ';learning curve,'; the practitioner with a
validated set of techniques and tools to face every challenge, and
researchers with a clear definition of the state-of-the-art and
emerging needs to guide their future efforts. This encyclopedia
will, thus, be of great interest to packaging engineers, electronic
product development engineers, and product managers, as well as to
researchers in thermal management of electronic and photonic
components and systems, and most beneficial to undergraduate and
graduate students studying mechanical, electrical, and electronic
engineering.
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