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Nickel & Copper Electroless Deposition (Paperback)
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Nickel & Copper Electroless Deposition (Paperback)
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Different kinds of methods such as Chemical Vapor Deposition (CVD),
Physical Vapor Deposition (PVD), Sol-Gel Deposition (SGD), Thermal
Spray Deposition (TSD), Jet Vapor Deposition (JVD), Triboadhesion
Deposition (TAD), & Electroless Deposition (ELD) were used for
the coating of metal oxides on glass substrates but it was found
that Electroless Deposition is the most effective and common method
for deposition of metal oxides on glass substrate due to its unique
characteristics. Effectiveness of deposition was studied by the
stability of metal oxides (Nickel & Copper Oxides) layer on
glass substrate. Stability was measured by comparing the duration
of crack formation at different temperatures and by changing the
composition of metallic & reducing agents solutions, on glass
substrate. Cracks formation was noted and measure with the help of
High Efficient Microscope. Metallic & Reducing agent solutions
properties were also noted by preparing them with different
methods. Reducing agents that commonly used in deposition are
hydrogen compounds, in which hydrogen atom is linked to phosphorus,
nitrogen, and carbon i.e, Sodium Hypophosphite,
Dimethylamine-borane, Hydrazine and Formaldehyde
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