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Three-Dimensional Integrated Circuit Design (Paperback, 2nd edition)
Loot Price: R2,270
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Three-Dimensional Integrated Circuit Design (Paperback, 2nd edition)
Expected to ship within 12 - 19 working days
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Three-Dimensional Integrated Circuit Design, Second Eition, expands
the original with more than twice as much new content, adding the
latest developments in circuit models, temperature considerations,
power management, memory issues, and heterogeneous integration. 3-D
IC experts Pavlidis, Savidis, and Friedman cover the full product
development cycle throughout the book, emphasizing not only
physical design, but also algorithms and system-level
considerations to increase speed while conserving energy. A handy,
comprehensive reference or a practical design guide, this book
provides effective solutions to specific challenging problems
concerning the design of three-dimensional integrated circuits.
Expanded with new chapters and updates throughout based on the
latest research in 3-D integration: Manufacturing techniques for
3-D ICs with TSVs Electrical modeling and closed-form expressions
of through silicon vias Substrate noise coupling in heterogeneous
3-D ICs Design of 3-D ICs with inductive links Synchronization in
3-D ICs Variation effects on 3-D ICs Correlation of WID variations
for intra-tier buffers and wires
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