Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging (Paperback)

Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI). The emphasis is put on two essential passive components of PCBs and packages: the power distribution network and the signal distribution network. This book includes two parts. Part one talks about the field-circuit hybrid methods used for the EMC modeling, including the modal method, the integral equation method, the cylindrical wave expansion method and the de-embedding method. Part two illustrates EMC design methods and explores the applications of novel metamaterials and two-dimensional materials on traditional EMC problems. This book is designed to enhance worthwhile electromagnetic theory and mathematical methods for practical engineers and to train students with advanced EMC applications.

General

Imprint:	Crc Press
Country of origin:	United Kingdom
Release date:	June 2020
First published:	2017
Authors:	Xing-Chang Wei
Dimensions:	234 x 156mm (L x W)
Format:	Paperback
Pages:	322
ISBN-13:	978-0-367-57366-9
Categories:	Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Circuits & components Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Microwave technology
LSN:	0-367-57366-0
Barcode:	9780367573669

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