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Manufacturing Challenges in Electronic Packaging (Hardcover, 1998 ed.)
Loot Price: R2,945
Discovery Miles 29 450
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Manufacturing Challenges in Electronic Packaging (Hardcover, 1998 ed.)
Expected to ship within 10 - 15 working days
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Donate to Against Period Poverty
Total price: R2,955
Discovery Miles: 29 550
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About five to six years ago, the words 'packaging and
manufacturing' started to be used together to emphasize that we
have to make not only a few but thousands or even millions of
packages which meet functional requirements. The aim of this book
is to provide the much needed reviews and in-depth discussions on
the advanced topics surrounding packaging and manufacturing. The
first chapter gives a comprehensive review of manufacturing chal
lenges in electronic packaging based on trends predicted by
different resources. Almost all the functional specifications have
already been met by technologies demonstrated in laboratories.
However, it would take tremendous efforts to implement these
technologies for mass production or flexible manufacturing. The
topics crucial to this implementation are discussed in the
following chapters: Chapter 2: Challenges in solder assembly
technologies; Chapter 3: Testing and characterization; Chapter 4:
Design for manufacture and assembly of electronic packages; Chapter
5: Process modeling, optimization and control in electronics
manufacturing; and Chapter 6: Integrated manufacturing system for
printed circuit board assembly. The electronics-based products are
very competitive and becoming more and more application-specific.
Their packages should fulfill cost, speed, power, weight, size,
reliability and time-to-market requirements. More importantly, the
packages should be manufacturable in mass or flexible production
lines. These chapters are excellent references for professionals
who need to meet the challenge through design and manufacturing
improvements. This book will also introduce students to the
critical issues for competitive design and manufacturing in
electronic packaging."
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