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Three-Dimensional Integrated Circuit Design - EDA, Design and Microarchitectures (Hardcover, 2010 ed.) Loot Price: R4,322
Discovery Miles 43 220
You Save: R286 (6%)
Three-Dimensional Integrated Circuit Design - EDA, Design and Microarchitectures (Hardcover, 2010 ed.): Yuan Xie, Jingsheng...

Three-Dimensional Integrated Circuit Design - EDA, Design and Microarchitectures (Hardcover, 2010 ed.)

Yuan Xie, Jingsheng Jason Cong, Sachin Sapatnekar

Series: Integrated Circuits and Systems

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List price R4,608 Loot Price R4,322 Discovery Miles 43 220 | Repayment Terms: R405 pm x 12* You Save R286 (6%)

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We live in a time of great change. In the electronics world, the last several decades have seen unprecedented growth and advancement, described by Moore's law. This observation stated that transistor density in integrated circuits doubles every 1. 5-2 years. This came with the simultaneous improvement of individual device perf- mance as well as the reduction of device power such that the total power of the resulting ICs remained under control. No trend remains constant forever, and this is unfortunately the case with Moore's law. The trouble began a number of years ago when CMOS devices were no longer able to proceed along the classical scaling trends. Key device parameters such as gate oxide thickness were simply no longer able to scale. As a result, device o- state currents began to creep up at an alarming rate. These continuing problems with classical scaling have led to a leveling off of IC clock speeds to the range of several GHz. Of course, chips can be clocked higher but the thermal issues become unmanageable. This has led to the recent trend toward microprocessors with mul- ple cores, each running at a few GHz at the most. The goal is to continue improving performance via parallelism by adding more and more cores instead of increasing speed. The challenge here is to ensure that general purpose codes can be ef?ciently parallelized. There is another potential solution to the problem of how to improve CMOS technology performance: three-dimensional integrated circuits (3D ICs).

General

Imprint: Springer-Verlag New York
Country of origin: United States
Series: Integrated Circuits and Systems
Release date: December 2009
First published: 2010
Editors: Yuan Xie • Jingsheng Jason Cong • Sachin Sapatnekar
Dimensions: 235 x 155 x 24mm (L x W x T)
Format: Hardcover
Pages: 284
Edition: 2010 ed.
ISBN-13: 978-1-4419-0783-7
Categories: Books > Professional & Technical > Industrial chemistry & manufacturing technologies > Industrial chemistry > Surface-coating technology
Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Circuits & components
Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Electronic devices & materials > General
LSN: 1-4419-0783-1
Barcode: 9781441907837

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