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Three-Dimensional Integrated Circuit Design - EDA, Design and Microarchitectures (Hardcover, 2010 ed.)
Loot Price: R4,517
Discovery Miles 45 170
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Three-Dimensional Integrated Circuit Design - EDA, Design and Microarchitectures (Hardcover, 2010 ed.)
Series: Integrated Circuits and Systems
Expected to ship within 10 - 15 working days
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We live in a time of great change. In the electronics world, the
last several decades have seen unprecedented growth and
advancement, described by Moore's law. This observation stated that
transistor density in integrated circuits doubles every 1. 5-2
years. This came with the simultaneous improvement of individual
device perf- mance as well as the reduction of device power such
that the total power of the resulting ICs remained under control.
No trend remains constant forever, and this is unfortunately the
case with Moore's law. The trouble began a number of years ago when
CMOS devices were no longer able to proceed along the classical
scaling trends. Key device parameters such as gate oxide thickness
were simply no longer able to scale. As a result, device o- state
currents began to creep up at an alarming rate. These continuing
problems with classical scaling have led to a leveling off of IC
clock speeds to the range of several GHz. Of course, chips can be
clocked higher but the thermal issues become unmanageable. This has
led to the recent trend toward microprocessors with mul- ple cores,
each running at a few GHz at the most. The goal is to continue
improving performance via parallelism by adding more and more cores
instead of increasing speed. The challenge here is to ensure that
general purpose codes can be ef?ciently parallelized. There is
another potential solution to the problem of how to improve CMOS
technology performance: three-dimensional integrated circuits (3D
ICs).
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