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Containing more than 300 equations and nearly 500 drawings,
photographs, and micrographs, this reference surveys key areas such
as optical measurements and in-line calibration methods. It
describes cleanroom-based measurement technology used during the
manufacture of silicon integrated circuits and covers model-based,
critical dimension, overlay, acoustic film thickness, dopant dose,
junction depth, and electrical measurements; particle and defect
detection; and flatness following chemical mechanical polishing.
Providing examples of well-developed metrology capability, the book
focuses on metrology for lithography, transistor, capacitor, and
on-chip interconnect process technologies.
Containing more than 300 equations and nearly 500 drawings,
photographs, and micrographs, this reference surveys key areas such
as optical measurements and in-line calibration methods. It
describes cleanroom-based measurement technology used during the
manufacture of silicon integrated circuits and covers model-based,
critical dimension, overlay, acoustic film thickness, dopant dose,
junction depth, and electrical measurements; particle and defect
detection; and flatness following chemical mechanical polishing.
Providing examples of well-developed metrology capability, the book
focuses on metrology for lithography, transistor, capacitor, and
on-chip interconnect process technologies.
Retaining the comprehensive and in-depth approach that cemented the
bestselling first edition's place as a standard reference in the
field, the Handbook of Semiconductor Manufacturing Technology,
Second Edition features new and updated material that keeps it at
the vanguard of today's most dynamic and rapidly growing field.
Iconic experts Robert Doering and Yoshio Nishi have again assembled
a team of the world's leading specialists in every area of
semiconductor manufacturing to provide the most reliable,
authoritative, and industry-leading information available. Stay
Current with the Latest Technologies In addition to updates to
nearly every existing chapter, this edition features five entirely
new contributions on... -Silicon-on-insulator (SOI) materials and
devices -Supercritical CO2 in semiconductor cleaning -Low-κ
dielectrics -Atomic-layer deposition -Damascene copper
electroplating -Effects of terrestrial radiation on integrated
circuits (ICs) Reflecting rapid progress in many areas, several
chapters were heavily revised and updated, and in some cases,
rewritten to reflect rapid advances in such areas as interconnect
technologies, gate dielectrics, photomask fabrication, IC
packaging, and 300 mm wafer fabrication. While no book can be
up-to-the-minute with the advances in the semiconductor field, the
Handbook of Semiconductor Manufacturing Technology keeps the most
important data, methods, tools, and techniques close at hand.
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