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Here is the first book to discuss the current understanding of
silver metallization and its potential as a future interconnect
material for integrated circuit technology. With the lowest
resistivity of all metals, silver is an attractive interconnect
material for higher current densities and faster switching speeds
in integrated circuits. Over the past ten years, extensive research
has been conducted to address the issues that have prevented silver
from being used as an interconnect metal. The authors provide
details on a wide range of experimental, characterization, and
analysis techniques. The book is written for students, scientists,
engineers, and technologists in the fields of integrated circuits
and microelectronics research and development.
Here is the first book to discuss the current understanding of
silver metallization and its potential as a future interconnect
material for integrated circuit technology. With the lowest
resistivity of all metals, silver is an attractive interconnect
material for higher current densities and faster switching speeds
in integrated circuits. Over the past ten years, extensive research
has been conducted to address the issues that have prevented silver
from being used as an interconnect metal. The authors provide
details on a wide range of experimental, characterization, and
analysis techniques. The book is written for students, scientists,
engineers, and technologists in the fields of integrated circuits
and microelectronics research and development.
Unlucky, overconfident, zany adventurer Todd Daniels takes readers
through ridiculous scenarios in an attempt to spread his
adventuring "knowledge." Always condescending and arrogant, he
simplifies his explanations to an ABC format. Includes twenty-six
pages of full-color comics and a hilarious three page glossary,
defining terms from Todd's perspective.
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