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This book offers a comprehensive reference guide for graduate
students and professionals in both academia and industry, covering
the fundamentals, architecture, processing details, and
applications of 3D microelectronic packaging. It provides readers
an in-depth understanding of the latest research and development
findings regarding this key industry trend, including TSV, die
processing, micro-bumps for LMI and MMI, direct bonding and
advanced materials, as well as quality, reliability, fault
isolation, and failure analysis for 3D microelectronic packages.
Images, tables, and didactic schematics are used to illustrate and
elaborate on the concepts discussed. Readers will gain a general
grasp of 3D packaging, quality and reliability concerns, and common
causes of failure, and will be introduced to developing areas and
remaining gaps in 3D packaging that can help inspire future
research and development.
This volume provides a comprehensive reference for graduate
students and professionals in both academia and industry on the
fundamentals, processing details, and applications of 3D
microelectronic packaging, an industry trend for future
microelectronic packages. Chapters written by experts cover the
most recent research results and industry progress in the following
areas: TSV, die processing, micro bumps, direct bonding, thermal
compression bonding, advanced materials, heat dissipation, thermal
management, thermal mechanical modeling, quality, reliability,
fault isolation, and failure analysis of 3D microelectronic
packages. Numerous images, tables, and didactic schematics are
included throughout. This essential volume equips readers with an
in-depth understanding of all aspects of 3D packaging, including
packaging architecture, processing, thermal mechanical and moisture
related reliability concerns, common failures, developing areas,
and future challenges, providing insights into key areas for future
research and development.
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