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3D Microelectronic Packaging - From Fundamentals to Applications (Paperback, Softcover reprint of the original 1st ed. 2017)
Loot Price: R5,391
Discovery Miles 53 910
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3D Microelectronic Packaging - From Fundamentals to Applications (Paperback, Softcover reprint of the original 1st ed. 2017)
Series: Springer Series in Advanced Microelectronics, 57
Expected to ship within 10 - 15 working days
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This volume provides a comprehensive reference for graduate
students and professionals in both academia and industry on the
fundamentals, processing details, and applications of 3D
microelectronic packaging, an industry trend for future
microelectronic packages. Chapters written by experts cover the
most recent research results and industry progress in the following
areas: TSV, die processing, micro bumps, direct bonding, thermal
compression bonding, advanced materials, heat dissipation, thermal
management, thermal mechanical modeling, quality, reliability,
fault isolation, and failure analysis of 3D microelectronic
packages. Numerous images, tables, and didactic schematics are
included throughout. This essential volume equips readers with an
in-depth understanding of all aspects of 3D packaging, including
packaging architecture, processing, thermal mechanical and moisture
related reliability concerns, common failures, developing areas,
and future challenges, providing insights into key areas for future
research and development.
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