3D Microelectronic Packaging - From Fundamentals to Applications (Paperback, Softcover reprint of the original 1st ed. 2017)

This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development.

General

Imprint:	Springer International Publishing AG
Country of origin:	Switzerland
Series:	Springer Series in Advanced Microelectronics, 57
Release date:	July 2018
First published:	2017
Editors:	Yan Li • Deepak Goyal
Dimensions:	235 x 155 x 24mm (L x W x T)
Format:	Paperback
Pages:	463
Edition:	Softcover reprint of the original 1st ed. 2017
ISBN-13:	978-3-319-83086-5
Categories:	Books > Professional & Technical > Industrial chemistry & manufacturing technologies > Metals technology / metallurgy Books > Professional & Technical > Industrial chemistry & manufacturing technologies > Industrial chemistry > Chemical engineering Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Circuits & components Books > Professional & Technical > Industrial chemistry & manufacturing technologies > Other manufacturing technologies > Precision instruments manufacture > General Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Electronic devices & materials > General Promotions
LSN:	3-319-83086-4
Barcode:	9783319830865

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