3D Microelectronic Packaging - From Architectures to Applications (Hardcover, 2nd ed. 2021)

This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.

General

Imprint:	Springer Verlag, Singapore
Country of origin:	Singapore
Series:	Springer Series in Advanced Microelectronics, 64
Release date:	November 2020
First published:	2021
Editors:	Yan Li • Deepak Goyal
Dimensions:	235 x 155mm (L x W)
Format:	Hardcover
Pages:	622
Edition:	2nd ed. 2021
ISBN-13:	978-981-15-7089-6
Categories:	Books > Professional & Technical > Industrial chemistry & manufacturing technologies > Metals technology / metallurgy Books > Professional & Technical > Industrial chemistry & manufacturing technologies > Industrial chemistry > Chemical engineering Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Circuits & components Books > Professional & Technical > Industrial chemistry & manufacturing technologies > Other manufacturing technologies > Precision instruments manufacture > General Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Electronic devices & materials > General
LSN:	981-15-7089-2
Barcode:	9789811570896

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