Examines all important aspects of integrated circuit design, fabrication, assembly and test processes as they relate to quality and reliability. This second edition discusses in detail: the latest circuit design technology trends; the sources of error in wafer fabrication and assembly; avenues of contamination; new IC packaging methods; new in-line process monitors and test structures; and more.;This work should be useful to electrical and electronics, quality and reliability, and industrial engineers; computer scientists; integrated circuit manufacturers; and upper-level undergraduate, graduate and continuing-education students in these disciplines.

Applies the methods of modern quality to the testing of digital integrated circuits. Explains new paradigms and techniques ranging from SSI to high-level VLSI, and how to match testing methods to the design and physical layout of the device. Accounts for the change in the electronics industry from a

Examines numerous examples of highly sensitive products such as satellites, measuring instruments, and high-end computers and servers for processing financial transactions. Practical Reliability of Electronic Equipment and Products discusses concurrent engineering/design teams power supply considerations part derating and stress analysis thermal management failure modes and effects analysis environmental stress screening design for manufacture component sourcing and manufacturing issues and explores the detection of design errors thermal analysis models and tools electromagnetic compatibility, ESD, and signal integrity printed wiring assembly and testing, electrical testing, and test design software development, availability, and quality Practical Reliability of Electronic Equipment and Products will help electrical, electronics, manufacturing, mechanical, systems design, and reliability engineers; electronics production managers; electronic circuit designers; and upper-level undergraduate and graduate students in these disciplines.