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Examines all important aspects of integrated circuit design,
fabrication, assembly and test processes as they relate to quality
and reliability. This second edition discusses in detail: the
latest circuit design technology trends; the sources of error in
wafer fabrication and assembly; avenues of contamination; new IC
packaging methods; new in-line process monitors and test
structures; and more.;This work should be useful to electrical and
electronics, quality and reliability, and industrial engineers;
computer scientists; integrated circuit manufacturers; and
upper-level undergraduate, graduate and continuing-education
students in these disciplines.
Applies the methods of modern quality to the testing of digital
integrated circuits. Explains new paradigms and techniques ranging
from SSI to high-level VLSI, and how to match testing methods to
the design and physical layout of the device. Accounts for the
change in the electronics industry from a
Examines numerous examples of highly sensitive products such as
satellites, measuring instruments, and high-end computers and
servers for processing financial transactions. Practical
Reliability of Electronic Equipment and Products discusses
concurrent engineering/design teams power supply considerations
part derating and stress analysis thermal management failure modes
and effects analysis environmental stress screening design for
manufacture component sourcing and manufacturing issues and
explores the detection of design errors thermal analysis models and
tools electromagnetic compatibility, ESD, and signal integrity
printed wiring assembly and testing, electrical testing, and test
design software development, availability, and quality Practical
Reliability of Electronic Equipment and Products will help
electrical, electronics, manufacturing, mechanical, systems design,
and reliability engineers; electronics production managers;
electronic circuit designers; and upper-level undergraduate and
graduate students in these disciplines.
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