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This book explains for readers how 3D chip stacks promise to
increase the level of on-chip integration, and to design new
heterogeneous semiconductor devices that combine chips of different
integration technologies (incl. sensors) in a single package of the
smallest possible size. The authors focus on heterogeneous 3D
integration, addressing some of the most important challenges in
this emerging technology, including contactless, optics-based, and
carbon-nanotube-based 3D integration, as well as signal-integrity
and thermal management issues in copper-based 3D integration.
Coverage also includes the 3D heterogeneous integration of power
sources, photonic devices, and non-volatile memories based on new
materials systems.
This book explains for readers how 3D chip stacks promise to
increase the level of on-chip integration, and to design new
heterogeneous semiconductor devices that combine chips of different
integration technologies (incl. sensors) in a single package of the
smallest possible size. The authors focus on heterogeneous 3D
integration, addressing some of the most important challenges in
this emerging technology, including contactless, optics-based, and
carbon-nanotube-based 3D integration, as well as signal-integrity
and thermal management issues in copper-based 3D integration.
Coverage also includes the 3D heterogeneous integration of power
sources, photonic devices, and non-volatile memories based on new
materials systems.
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