3D Stacked Chips - From Emerging Processes to Heterogeneous Systems (Paperback, Softcover reprint of the original 1st ed. 2016)

This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.

General

Imprint:	Springer International Publishing AG
Country of origin:	Switzerland
Release date:	May 2018
First published:	2016
Editors:	Ibrahim (Abe) M Elfadel • Gerhard Fettweis
Dimensions:	235 x 155 x 19mm (L x W x T)
Format:	Paperback
Pages:	339
Edition:	Softcover reprint of the original 1st ed. 2016
ISBN-13:	978-3-319-79305-4
Categories:	Books > Computing & IT > Computer hardware & operating systems > Mainframes & minicomputers Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Circuits & components Books > Computing & IT > Computer hardware & operating systems > Computer architecture & logic design > General
LSN:	3-319-79305-5
Barcode:	9783319793054

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