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Micromachined Thin-Film Sensors for SOI-CMOS Co-Integration (Hardcover, 2006 ed.): Jean Laconte, Denis Flandre, Jean-Pierre... Micromachined Thin-Film Sensors for SOI-CMOS Co-Integration (Hardcover, 2006 ed.)
Jean Laconte, Denis Flandre, Jean-Pierre Raskin
R4,402 Discovery Miles 44 020 Ships in 10 - 15 working days

Co-integration of sensors with their associated electronics on a single silicon chip may provide many significant benefits regarding performance, reliability, miniaturization and process simplicity without significantly increasing the total cost.

Micromachined Thin-Film Sensors for SOI-CMOS Co-integration covers the challenges and interests and demonstrates the successful co-integration of gas-flow sensors on dielectric membrane, with their associated electronics, in CMOS-SOI technology.

We firstly investigate the extraction of residual stress in thin layers and in their stacking and the release, in post-processing, of a 1 Am-thick robust and flat dielectric multilayered membrane using Tetramethyl Ammonium Hydroxide (TMAH) silicon micromachining solution. The optimization of its selectivity towards aluminum is largely demonstrated.

The second part focuses on sensors design and characteristics. A novel loop-shape polysilicon microheater is designed and built in a CMOS-SOI standard process. High thermal uniformity, low power consumption and high working temperature are confirmed by extensive measurements. The additional gas flow sensing layers are judiciously chosen and implemented. Measurements in the presence of a nitrogen flow and gas reveal fair sensitivity on a large flow velocity range as well as good response to many gases. Finally, MOS transistors suspended on released dielectric membranes are presented and fully characterized as a concluding demonstrator of the co-integration in SOI technology.

Semiconductor-On-Insulator Materials for Nanoelectronics Applications (Hardcover, 2011 ed.): Alexei Nazarov, J.-p. Colinge,... Semiconductor-On-Insulator Materials for Nanoelectronics Applications (Hardcover, 2011 ed.)
Alexei Nazarov, J.-p. Colinge, Francis Balestra, Jean-Pierre Raskin, Francisco Gamiz, …
R4,323 Discovery Miles 43 230 Ships in 10 - 15 working days

"Semiconductor-On-Insulator Materials for NanoElectronics Applications is devoted to the fast evolving field of modern nanoelectronics, and more particularly to the physics and technology of nanoelectronic devices built on semiconductor-on-insulator (SemOI) systems. The book contains the achievements in this field from leading companies and universities in Europe, USA, Brazil and Russia. It is articulated around four main topics: 1. New semiconductor-on-insulator materials; 2. Physics of modern SemOI devices; 3. Advanced characterization of SemOI devices; 4. Sensors and MEMS on SOI. "Semiconductor-On-Insulator Materials for NanoElectonics Applications is useful not only to specialists in nano- and microelectronics but also to students and to the wider audience of readers who are interested in new directions in modern electronics and optoelectronics.

Semiconductor-On-Insulator Materials for Nanoelectronics Applications (Paperback, 2011 ed.): Alexei Nazarov, J.-p. Colinge,... Semiconductor-On-Insulator Materials for Nanoelectronics Applications (Paperback, 2011 ed.)
Alexei Nazarov, J.-p. Colinge, Francis Balestra, Jean-Pierre Raskin, Francisco Gamiz, …
R4,276 Discovery Miles 42 760 Ships in 10 - 15 working days

"Semiconductor-On-Insulator Materials for NanoElectronics Applications" is devoted to the fast evolving field of modern nanoelectronics, and more particularly to the physics and technology of nanoelectronic devices built on semiconductor-on-insulator (SemOI) systems. The book contains the achievements in this field from leading companies and universities in Europe, USA, Brazil and Russia. It is articulated around four main topics: 1. New semiconductor-on-insulator materials; 2. Physics of modern SemOI devices; 3. Advanced characterization of SemOI devices; 4. Sensors and MEMS on SOI. "Semiconductor-On-Insulator Materials for NanoElectonics Applications" is useful not only to specialists in nano- and microelectronics but also to students and to the wider audience of readers who are interested in new directions in modern electronics and optoelectronics.

Micromachined Thin-Film Sensors for SOI-CMOS Co-Integration (Paperback, Softcover reprint of hardcover 1st ed. 2006): Jean... Micromachined Thin-Film Sensors for SOI-CMOS Co-Integration (Paperback, Softcover reprint of hardcover 1st ed. 2006)
Jean Laconte, Denis Flandre, Jean-Pierre Raskin
R4,212 Discovery Miles 42 120 Ships in 10 - 15 working days

Co-integration of sensors with their associated electronics on a single silicon chip may provide many significant benefits regarding performance, reliability, miniaturization and process simplicity without significantly increasing the total cost.

Micromachined Thin-Film Sensors for SOI-CMOS Co-integration covers the challenges and interests and demonstrates the successful co-integration of gas-flow sensors on dielectric membrane, with their associated electronics, in CMOS-SOI technology.

We firstly investigate the extraction of residual stress in thin layers and in their stacking and the release, in post-processing, of a 1 um-thick robust and flat dielectric multilayered membrane using Tetramethyl Ammonium Hydroxide (TMAH) silicon micromachining solution. The optimization of its selectivity towards aluminum is largely demonstrated.

The second part focuses on sensors design and characteristics. A novel loop-shape polysilicon microheater is designed and built in a CMOS-SOI standard process. High thermal uniformity, low power consumption and high working temperature are confirmed by extensive measurements. The additional gas flow sensing layers are judiciously chosen and implemented. Measurements in the presence of a nitrogen flow and gas reveal fair sensitivity on a large flow velocity range as well as good response to many gases. Finally, MOS transistors suspended on released dielectric membranes are presented and fully characterized as a concluding demonstrator of the co-integration in SOI technology."

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