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Three-Dimensional Integration of Semiconductors - Processing, Materials, and Applications (Paperback, Softcover reprint of the... Three-Dimensional Integration of Semiconductors - Processing, Materials, and Applications (Paperback, Softcover reprint of the original 1st ed. 2015)
Kazuo Kondo, Morihiro Kada, Kenji Takahashi
R4,527 Discovery Miles 45 270 Ships in 10 - 15 working days

This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects.

Copper Electrodeposition for Nanofabrication of Electronics Devices (Paperback, Softcover reprint of the original 1st ed.... Copper Electrodeposition for Nanofabrication of Electronics Devices (Paperback, Softcover reprint of the original 1st ed. 2014)
Kazuo Kondo, Rohan N. Akolkar, Dale P. Barkey, Masayuki Yokoi
R3,296 Discovery Miles 32 960 Ships in 10 - 15 working days

This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as: * ULSI wiring material based upon copper nanowiring * Printed circuit boards * Stacked semiconductors * Through Silicon Via * Smooth copper foil for Lithium-Ion battery electrodes. This book is ideal for nanotechnologists, industry professionals, and practitioners.

Three-Dimensional Integration of Semiconductors - Processing, Materials, and Applications (Hardcover, 1st ed. 2015): Kazuo... Three-Dimensional Integration of Semiconductors - Processing, Materials, and Applications (Hardcover, 1st ed. 2015)
Kazuo Kondo, Morihiro Kada, Kenji Takahashi
R4,479 Discovery Miles 44 790 Ships in 10 - 15 working days

This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects.

Copper Electrodeposition for Nanofabrication of Electronics Devices (Hardcover, 2014 ed.): Kazuo Kondo, Rohan N. Akolkar, Dale... Copper Electrodeposition for Nanofabrication of Electronics Devices (Hardcover, 2014 ed.)
Kazuo Kondo, Rohan N. Akolkar, Dale P. Barkey, Masayuki Yokoi
R2,989 Discovery Miles 29 890 Ships in 10 - 15 working days

This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as: * ULSI wiring material based upon copper nanowiring * Printed circuit boards * Stacked semiconductors * Through Silicon Via * Smooth copper foil for Lithium-Ion battery electrodes. This book is ideal for nanotechnologists, industry professionals, and practitioners.

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