Copper Electrodeposition for Nanofabrication of Electronics Devices (Paperback, Softcover reprint of the original 1st ed. 2014)

This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as: * ULSI wiring material based upon copper nanowiring * Printed circuit boards * Stacked semiconductors * Through Silicon Via * Smooth copper foil for Lithium-Ion battery electrodes. This book is ideal for nanotechnologists, industry professionals, and practitioners.

General

Imprint:	Springer-Verlag New York
Country of origin:	United States
Series:	Nanostructure Science and Technology
Release date:	August 2016
First published:	2014
Editors:	Kazuo Kondo • Rohan N. Akolkar • Dale P. Barkey • Masayuki Yokoi
Dimensions:	235 x 155 x 15mm (L x W x T)
Format:	Paperback
Pages:	282
Edition:	Softcover reprint of the original 1st ed. 2014
ISBN-13:	978-1-4939-5373-8
Categories:	Books > Professional & Technical > Technology: general issues > Nanotechnology Books > Science & Mathematics > Chemistry > Physical chemistry > Electrochemistry & magnetochemistry Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > General Books > Science & Mathematics > Chemistry > Analytical chemistry > Qualitative analytical chemistry > Chemical spectroscopy, spectrochemistry > General
LSN:	1-4939-5373-7
Barcode:	9781493953738

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