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Symposium S, Microelectromechanical Systems Materials and Devices
IV, held November 29 December 3 at the 2010 MRS Fall Meeting in
Boston, Massachusetts, focused on micro- and nanoelectromechanical
systems (MEMS/NEMS), technologies which were spawned from the
fabrication and integration of small-scale mechanical, electrical,
thermal, magnetic, fluidic, and optical sensors and actuators with
micro-electronic components. MEMS and NEMS have enabled performance
enhancements and manufacturing cost reductions in a number of
applications, including optical displays, acceleration sensing,
radio-frequency switching, drug delivery, chemical detection, and
power generation and storage. Although originally based on silicon
microelectronics, the reach of MEMS and NEMS has extended well
beyond traditional engineering materials, and now includes
nanomaterials (nanotubes, nanowires, nanoparticles), smart
materials (piezoelectric and ferroelectric materials, shape memory
alloys, pH-sensitive polymers), metamaterials, and biomaterials
(ceramic, metallic, polymeric, composite based implant materials).
While these new materials provide more freedom with regards to the
design space of MEMS and NEMS, they also introduce a number of new
fabrication and characterization challenges not previously
encountered with silicon-based technology."
Microelectromechanical systems (MEMS) hold great promise for
sensing and actuating on the micron scale. There is a hierarchy of
increasing difficulty for placing MEMS devices in the field.
Devices that do not allow contact between structural members rely
mainly on mechanical properties of freestanding films.
High-resolution techniques must be developed within the framework
of MEMS to measure properties such as modulus and residual stress.
When contact and rubbing contact are allowed, the complexities of
adhesion and friction at the microscale must be understood and well
controlled. Fluid interactions are similarly important for
microfluidic devices. Packaging of MEMS for use in the field also
requires special consideration, because it is often application
specific. This book investigates various materials,
characterization methods and processing techniques. These
approaches represent different but useful strategies to solve MEMS
challenges, and must be integrated for product realization. Topics
include: deposition and characterization of Si; materials and
processes for MEMS; tribology; dynamic optical characterization;
packaging; LIGA; materials aspects; and characterization of MEMS
processing.
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