Microelectromechanical systems (MEMS) hold great promise for
sensing and actuating on the micron scale. There is a hierarchy of
increasing difficulty for placing MEMS devices in the field.
Devices that do not allow contact between structural members rely
mainly on mechanical properties of freestanding films.
High-resolution techniques must be developed within the framework
of MEMS to measure properties such as modulus and residual stress.
When contact and rubbing contact are allowed, the complexities of
adhesion and friction at the microscale must be understood and well
controlled. Fluid interactions are similarly important for
microfluidic devices. Packaging of MEMS for use in the field also
requires special consideration, because it is often application
specific. This book investigates various materials,
characterization methods and processing techniques. These
approaches represent different but useful strategies to solve MEMS
challenges, and must be integrated for product realization. Topics
include: deposition and characterization of Si; materials and
processes for MEMS; tribology; dynamic optical characterization;
packaging; LIGA; materials aspects; and characterization of MEMS
processing.
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