0
Your cart

Your cart is empty

Browse All Departments
  • All Departments
Price
  • R1,000 - R2,500 (3)
  • R2,500 - R5,000 (1)
  • R5,000 - R10,000 (1)
  • -
Status
Brand

Showing 1 - 5 of 5 matches in All Departments

Introduction to Microelectronics to Nanoelectronics - Design and Technology (Hardcover): Manoj Kumar Majumder, Vijay Rao... Introduction to Microelectronics to Nanoelectronics - Design and Technology (Hardcover)
Manoj Kumar Majumder, Vijay Rao Kumbhare, Aditya Japa, Brajesh Kumar Kaushik
R3,585 Discovery Miles 35 850 Ships in 12 - 19 working days

Focussing on micro- and nanoelectronics design and technology, this book provides thorough analysis and demonstration, starting from semiconductor devices to VLSI fabrication, designing (analog and digital), on-chip interconnect modeling culminating with emerging non-silicon/ nano devices. It gives detailed description of both theoretical as well as industry standard HSPICE, Verilog, Cadence simulation based real-time modeling approach with focus on fabrication of bulk and nano-devices. Each chapter of this proposed title starts with a brief introduction of the presented topic and ends with a summary indicating the futuristic aspect including practice questions. Aimed at researchers and senior undergraduate/graduate students in electrical and electronics engineering, microelectronics, nanoelectronics and nanotechnology, this book: Provides broad and comprehensive coverage from Microelectronics to Nanoelectronics including design in analog and digital electronics. Includes HDL, and VLSI design going into the nanoelectronics arena. Discusses devices, circuit analysis, design methodology, and real-time simulation based on industry standard HSPICE tool. Explores emerging devices such as FinFETs, Tunnel FETs (TFETs) and CNTFETs including their circuit co-designing. Covers real time illustration using industry standard Verilog, Cadence and Synopsys simulations.

Through Silicon Vias - Materials, Models, Design, and Performance (Paperback): Brajesh Kumar Kaushik, Vobulapuram Ramesh Kumar,... Through Silicon Vias - Materials, Models, Design, and Performance (Paperback)
Brajesh Kumar Kaushik, Vobulapuram Ramesh Kumar, Manoj Kumar Majumder, Arsalan Alam
R1,585 Discovery Miles 15 850 Ships in 12 - 19 working days

Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for Cu, carbon nanotube (CNT) and graphene nanoribbon (GNR) based TSVs are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR based TSVs are also discussed.

Introduction to Microelectronics to Nanoelectronics - Design and Technology: Manoj Kumar Majumder, Vijay Rao Kumbhare, Aditya... Introduction to Microelectronics to Nanoelectronics - Design and Technology
Manoj Kumar Majumder, Vijay Rao Kumbhare, Aditya Japa, Brajesh Kumar Kaushik
R1,474 Discovery Miles 14 740 Ships in 9 - 17 working days

Focussing on micro- and nanoelectronics design and technology, this book provides thorough analysis and demonstration, starting from semiconductor devices to VLSI fabrication, designing (analog and digital), on-chip interconnect modeling culminating with emerging non-silicon/ nano devices. It gives detailed description of both theoretical as well as industry standard HSPICE, Verilog, Cadence simulation based real-time modeling approach with focus on fabrication of bulk and nano-devices. Each chapter of this proposed title starts with a brief introduction of the presented topic and ends with a summary indicating the futuristic aspect including practice questions. Aimed at researchers and senior undergraduate/graduate students in electrical and electronics engineering, microelectronics, nanoelectronics and nanotechnology, this book: Provides broad and comprehensive coverage from Microelectronics to Nanoelectronics including design in analog and digital electronics. Includes HDL, and VLSI design going into the nanoelectronics arena. Discusses devices, circuit analysis, design methodology, and real-time simulation based on industry standard HSPICE tool. Explores emerging devices such as FinFETs, Tunnel FETs (TFETs) and CNTFETs including their circuit co-designing. Covers real time illustration using industry standard Verilog, Cadence and Synopsys simulations.

Carbon Nanotube Based VLSI Interconnects - Analysis and Design (Paperback, 2015 ed.): Brajesh Kumar Kaushik, Manoj Kumar... Carbon Nanotube Based VLSI Interconnects - Analysis and Design (Paperback, 2015 ed.)
Brajesh Kumar Kaushik, Manoj Kumar Majumder
R1,465 Discovery Miles 14 650 Ships in 10 - 15 working days

The brief primarily focuses on the performance analysis of CNT based interconnects in current research scenario. Different CNT structures are modeled on the basis of transmission line theory. Performance comparison for different CNT structures illustrates that CNTs are more promising than Cu or other materials used in global VLSI interconnects. The brief is organized into five chapters which mainly discuss: (1) an overview of current research scenario and basics of interconnects; (2) unique crystal structures and the basics of physical properties of CNTs, and the production, purification and applications of CNTs; (3) a brief technical review, the geometry and equivalent RLC parameters for different single and bundled CNT structures; (4) a comparative analysis of crosstalk and delay for different single and bundled CNT structures; and (5) various unique mixed CNT bundle structures and their equivalent electrical models.

Through Silicon Vias - Materials, Models, Design, and Performance (Hardcover): Brajesh Kumar Kaushik, Vobulapuram Ramesh Kumar,... Through Silicon Vias - Materials, Models, Design, and Performance (Hardcover)
Brajesh Kumar Kaushik, Vobulapuram Ramesh Kumar, Manoj Kumar Majumder, Arsalan Alam
R5,829 Discovery Miles 58 290 Ships in 12 - 19 working days

Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for Cu, carbon nanotube (CNT) and graphene nanoribbon (GNR) based TSVs are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR based TSVs are also discussed.

Free Delivery
Pinterest Twitter Facebook Google+
You may like...
Lawfare - Judging Politics In South…
Michelle Le Roux, Dennis Davis Paperback R320 R286 Discovery Miles 2 860
Intellectual Property Objectives in…
Pratyush Nath Upreti Hardcover R3,285 Discovery Miles 32 850
Reports of Cases Argued and Determined…
Massachusetts. Supreme Judicial Court. Paperback R789 Discovery Miles 7 890
Sword Catcher
Cassandra Clare Paperback R399 R362 Discovery Miles 3 620
Ariadne Florentina - Six Lectures on…
John Ruskin Paperback R599 Discovery Miles 5 990
Masters Of Death
Olivie Blake Paperback R385 R349 Discovery Miles 3 490
Microbial Xylanolytic Enzymes
Pratima Bajpai Paperback R3,653 Discovery Miles 36 530
United States Circuit Court of Appeals…
United States Court of Appeals Paperback R703 Discovery Miles 7 030
The History of the Rise, Progress and…
Thomas Clarkson Paperback R600 Discovery Miles 6 000
Guide to Yeast Genetics and Molecular…
Author Unknown Paperback R4,180 Discovery Miles 41 800

 

Partners