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Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Electronic devices & materials > Semi-conductors & super-conductors

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Through Silicon Vias - Materials, Models, Design, and Performance (Hardcover) Loot Price: R5,484
Discovery Miles 54 840
Repayment Terms: R514 pm x 12*
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Through Silicon Vias - Materials, Models, Design, and Performance (Hardcover): Brajesh Kumar Kaushik, Vobulapuram Ramesh Kumar,...

Through Silicon Vias - Materials, Models, Design, and Performance (Hardcover)

Brajesh Kumar Kaushik, Vobulapuram Ramesh Kumar, Manoj Kumar Majumder, Arsalan Alam

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Loot Price R5,484 Discovery Miles 54 840 | Repayment Terms: R514 pm x 12*

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Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for Cu, carbon nanotube (CNT) and graphene nanoribbon (GNR) based TSVs are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR based TSVs are also discussed.

General

Imprint: Productivity Press
Country of origin: United States
Release date: August 2016
First published: 2017
Authors: Brajesh Kumar Kaushik • Vobulapuram Ramesh Kumar • Manoj Kumar Majumder • Arsalan Alam
Dimensions: 234 x 156 x 18mm (L x W x T)
Format: Hardcover
Pages: 216
ISBN-13: 978-1-4987-4552-9
Categories: Books > Professional & Technical > Technology: general issues > Nanotechnology
Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Electronic devices & materials > Semi-conductors & super-conductors
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LSN: 1-4987-4552-0
Barcode: 9781498745529

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