|
Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Electronic devices & materials > Semi-conductors & super-conductors
|
Buy Now
Through Silicon Vias - Materials, Models, Design, and Performance (Hardcover)
Loot Price: R5,146
Discovery Miles 51 460
|
|
|
Through Silicon Vias - Materials, Models, Design, and Performance (Hardcover)
Expected to ship within 12 - 17 working days
|
Recent advances in semiconductor technology offer vertical
interconnect access (via) that extend through silicon, popularly
known as through silicon via (TSV). This book provides a
comprehensive review of the theory behind TSVs while covering most
recent advancements in materials, models and designs. Furthermore,
depending on the geometry and physical configurations, different
electrical equivalent models for Cu, carbon nanotube (CNT) and
graphene nanoribbon (GNR) based TSVs are presented. Based on the
electrical equivalent models the performance comparison among the
Cu, CNT and GNR based TSVs are also discussed.
General
Is the information for this product incomplete, wrong or inappropriate?
Let us know about it.
Does this product have an incorrect or missing image?
Send us a new image.
Is this product missing categories?
Add more categories.
Review This Product
No reviews yet - be the first to create one!
|
|
Email address subscribed successfully.
A activation email has been sent to you.
Please click the link in that email to activate your subscription.
Welcome to Loot.co.za!
Sign in / Register |Wishlists & Gift Vouchers |Help | Advanced search
