This pertinent and highly original volume explores how ideas of Europe and processes of continental political, socio-economic, and cultural integration have been intertwined since the nineteenth century. Applying a wider definition of Europeanization in the sense of "becoming European", it will pay equal attention to counter-processes of disentanglement and disintegration that have accompanied, slowed down, or displaced such trends and developments. By focusing on the practices, agents, and experience of Europeanization, the volume strives to bring together the history of ideas and the history of human actions and conduct, two approaches that are usually treated separately in the field of European studies.

This book contains the first comprehensive review of intrinsic point defects, impurities and their complexes in silicon. Besides compiling the structures, energetic properties, identified electrical levels and spectroscopic signatures, and the diffusion behaviour from investigations, it gives a comprehensive introduction into the relevant fundamental concepts.

SISDEP 95 provides an international forum for the presentation of state-of-the-art research and development results in the area of numerical process and device simulation. Continuously shrinking device dimensions, the use of new materials, and advanced processing steps in the manufacturing of semiconductor devices require new and improved software. The trend towards increasing complexity in structures and process technology demands advanced models describing all basic effects and sophisticated two and three dimensional tools for almost arbitrarily designed geometries. The book contains the latest results obtained by scientists from more than 20 countries on process simulation and modeling, simulation of process equipment, device modeling and simulation of novel devices, power semiconductors, and sensors, on device simulation and parameter extraction for circuit models, practical application of simulation, numerical methods, and software."

Basically all properties of semiconductor devices are influenced by the distribution of point defects in their active areas. This book contains the first comprehensive review of the properties of intrinsic point defects, acceptor and donor impurities, isovalent atoms, chalcogens, and halogens in silicon, as well as of their complexes. Special emphasis is placed on compiling the structures, energetic properties, identified electrical levels and spectroscopic signatures, and the diffusion behavior from experimental and theoretical investigations. In addition, the book discusses the fundamental concepts of silicon and its defects, the electron system, diffusion, thermodynamics, and reaction kinetics which form the scientific basis needed for a thorough understanding of the text. Therefore, the book is able to provide an introduction to newcomers in this field up to a comprehensive reference for experts in process technology, solid-state physics, and simulation of semiconductor processes.

Das Buch prasentiert einen programmatischen Ansatz einer aktuellen Zeithistorie und versteht sich als kritischer Beitrag der Orientierungswissenschaft im Anschluss an das Spatwerk Michel Foucaults. Die derzeitige Diskussion setzt sich nur ungenugend mit der Epoche seit 1989 auseinander. Globalisierung, regionale Integration, wirtschaftliche Krisen, Migration, Finanzwirtschaft und Terrorismus kennzeichnen eine neue Geschichte. Neue Freiheiten und Ambivalenzen der Kultur in Digitalisierung, Migration und Kommunikation bewirken Unsicherheiten, AEngste und Orientierungsverluste, gar den Zusammenbruch lange vorherrschender Identitatslandschaften. Das Buch greift dies auf, verortet sich theoretisch in der neuen Zeit und schlagt empirische Themenbereiche vor.

SISDEP a (TM)95 provides an international forum for the presentation of state-of-the-art research and development results in the area of numerical process and device simulation. Continuously shrinking device dimensions, the use of new materials, and advanced processing steps in the manufacturing of semiconductor devices require new and improved software. The trend towards increasing complexity in structures and process technology demands advanced models describing all basic effects and sophisticated two and three dimensional tools for almost arbitrarily designed geometries. The book contains the latest results obtained by scientists from more than 20 countries on process simulation and modeling, simulation of process equipment, device modeling and simulation of novel devices, power semiconductors, and sensors, on device simulation and parameter extraction for circuit models, practical application of simulation, numerical methods, and software.