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Achieving cost-effective performance over time requires an
organized, disciplined, and time-phased approach to product design,
development, qualification, manufacture, and in-service management.
Guidebook for Managing Silicon Chip Reliability examines the
principal failure mechanisms associated with modern integrated
circuits and describes common practices used to resolve them. This
quick reference on semiconductor reliability addresses the key
question: How will the understanding of failure mechanisms affect
the future? Chapters discuss: failure sites, operational loads, and
failure mechanism intrinsic device sensitivities electromigration
hot carrier aging time dependent dielectric breakdown mechanical
stress induced migration alpha particle sensitivity electrostatic
discharge (ESD) and electrical overstress latch-up qualification
screening guidelines for designing reliability Guidebook for
Managing Silicon Chip Reliability focuses on device failure and
causes throughout - providing a thorough framework on how to model
the mechanism, test for defects, and avoid and manage damage. It
will serve as an exceptional resource for electrical engineers as
well as mechanical engineers working in the field of electronic
packaging.
Achieving cost-effective performance over time requires an organized, disciplined, and time-phased approach to product design, development, qualification, manufacture, and in-service management. Guidebook for Managing Silicon Chip Reliability examines the principal failure mechanisms associated with modern integrated circuits and describes common practices used to resolve them.
This quick reference on semiconductor reliability addresses the key question: How will the understanding of failure mechanisms affect the future?
Chapters discuss: o failure sites, operational loads, and failure mechanism o intrinsic device sensitivities o electromigration o hot carrier aging o time dependent dielectric breakdown o mechanical stress induced migration o alpha particle sensitivity o electrostatic discharge (ESD) and electrical overstress o latch-up o qualification o screening o guidelines for designing reliability
Guidebook for Managing Silicon Chip Reliability focuses on device failure and causes throughout - providing a thorough framework on how to model the mechanism, test for defects, and avoid and manage damage. It will serve as an exceptional resource for electrical engineers as well as mechanical engineers working in the field of electronic packaging.
This book presents the real challenges and experiences of managing
an advanced semiconductor technology development and integration
program - but using a novelized form. The material is presented in
a conversational format through a story that follows a fictional
narrator as she grows from an intern to a manager in a (fictional)
chip company. The story describes the technology development
program from management, engineering and human perspectives, and
exposes not only the management and technical issues but also the
typical work-life balance challenges experienced by engineers
working in the technology industry. Use of a series of realistic
and representative vignettes, supported by a set of illustrative
cartoon-ish panels, presents the serious management topics in a
light and readable way.
This book presents a realistic and a holistic review of the
microelectronic and semiconductor technology options in the post
Moore's Law regime. Technical tradeoffs, from architecture down to
manufacturing processes, associated with the 2.5D and 3D
integration technologies, as well as the business and product
management considerations encountered when faced by disruptive
technology options, are presented. Coverage includes a discussion
of Integrated Device Manufacturer (IDM) vs Fabless, vs Foundry, and
Outsourced Assembly and Test (OSAT) barriers to implementation of
disruptive technology options. This book is a must-read for any IC
product team that is considering getting off the Moore's Law track,
and leveraging some of the More-than-Moore technology options for
their next microelectronic product.
This book presents a realistic and a holistic review of the
microelectronic and semiconductor technology options in the post
Moore's Law regime. Technical tradeoffs, from architecture down to
manufacturing processes, associated with the 2.5D and 3D
integration technologies, as well as the business and product
management considerations encountered when faced by disruptive
technology options, are presented. Coverage includes a discussion
of Integrated Device Manufacturer (IDM) vs Fabless, vs Foundry, and
Outsourced Assembly and Test (OSAT) barriers to implementation of
disruptive technology options. This book is a must-read for any IC
product team that is considering getting off the Moore's Law track,
and leveraging some of the More-than-Moore technology options for
their next microelectronic product.
This book presents the real challenges and experiences of managing
an advanced semiconductor technology development and integration
program - but using a novelized form. The material is presented in
a conversational format through a story that follows a fictional
narrator as she grows from an intern to a manager in a (fictional)
chip company. The story describes the technology development
program from management, engineering and human perspectives, and
exposes not only the management and technical issues but also the
typical work-life balance challenges experienced by engineers
working in the technology industry. Use of a series of realistic
and representative vignettes, supported by a set of illustrative
cartoon-ish panels, presents the serious management topics in a
light and readable way.
Three-dimensional (3D) integrated circuit (IC) stacking is the next
big step in electronic system integration. It enables packing more
functionality, as well as integration of heterogeneous materials,
devices, and signals, in the same space (volume). This results in
consumer electronics (e.g., mobile, handheld devices) which can run
more powerful applications, such as full-length movies and 3D
games, with longer battery life. This technology is so promising
that it is expected to be a mainstream technology a few years from
now, less than 10-15 years from its original conception. To achieve
this type of end product, changes in the entire manufacturing and
design process of electronic systems are taking place. This book
provides readers with an accessible tutorial on a broad range of
topics essential to the non-expert in 3D System Integration. It is
an invaluable resource for anybody in need of an overview of the 3D
manufacturing and design chain.
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