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Wafer Bonding - Applications and Technology (Hardcover, 2004 ed.): Marin Alexe, Ulrich Goesele Wafer Bonding - Applications and Technology (Hardcover, 2004 ed.)
Marin Alexe, Ulrich Goesele
R8,871 Discovery Miles 88 710 Ships in 18 - 22 working days

The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.

Wafer Bonding - Applications and Technology (Paperback, Softcover reprint of the original 1st ed. 2004): Marin Alexe, Ulrich... Wafer Bonding - Applications and Technology (Paperback, Softcover reprint of the original 1st ed. 2004)
Marin Alexe, Ulrich Goesele
R8,828 Discovery Miles 88 280 Ships in 18 - 22 working days

The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.

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