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Wafer Bonding - Applications and Technology (Paperback, Softcover reprint of the original 1st ed. 2004) Loot Price: R8,828
Discovery Miles 88 280
Repayment Terms: R827 pm x 12*
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Wafer Bonding - Applications and Technology (Paperback, Softcover reprint of the original 1st ed. 2004): Marin Alexe, Ulrich...

Wafer Bonding - Applications and Technology (Paperback, Softcover reprint of the original 1st ed. 2004)

Marin Alexe, Ulrich Goesele

Series: Springer Series in Materials Science, 75

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Loot Price R8,828 Discovery Miles 88 280 | Repayment Terms: R827 pm x 12*

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The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.

General

Imprint: Springer-Verlag
Country of origin: Germany
Series: Springer Series in Materials Science, 75
Release date: September 2011
First published: 2004
Editors: Marin Alexe • Ulrich Goesele
Dimensions: 235 x 155 x 27mm (L x W x T)
Format: Paperback
Pages: 504
Edition: Softcover reprint of the original 1st ed. 2004
ISBN-13: 978-3-642-05915-5
Categories: Books > Science & Mathematics > Physics > States of matter > General
Books > Professional & Technical > Energy technology & engineering > Electrical engineering > General
Books > Professional & Technical > Mechanical engineering & materials > Materials science > Testing of materials > General
Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Electronic devices & materials > General
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LSN: 3-642-05915-5
Barcode: 9783642059155

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