0
Your cart

Your cart is empty

Books > Professional & Technical > Mechanical engineering & materials > Engineering skills & trades

Buy Now

BSIM-Bulk Mosfet Model for Wireless and Mixed-Mode ICs (Paperback) Loot Price: R4,530
Discovery Miles 45 300
BSIM-Bulk Mosfet Model for Wireless and Mixed-Mode ICs (Paperback): Chenming Hu, Harshit Agarwal, Chetan Gupta, Yogesh Singh...

BSIM-Bulk Mosfet Model for Wireless and Mixed-Mode ICs (Paperback)

Chenming Hu, Harshit Agarwal, Chetan Gupta, Yogesh Singh Chauhan

Series: Woodhead Publishing Series in Electronic and Optical Materials

 (sign in to rate)
Loot Price R4,530 Discovery Miles 45 300 | Repayment Terms: R425 pm x 12*

Bookmark and Share

Expected to ship within 12 - 17 working days

Donate to Gift Of The Givers

BSIM-Bulk Mosfet Model for Wireless and Mixed-Mode ICs provides in-depth knowledge of the internal operation of the model. The authors not only discuss the fundamental core of the model, but also provide details of the recent developments and new real-device effect models. In addition, the book covers the parameter extraction procedures, addressing geometrical scaling, temperatures, and more. There is also a dedicated chapter on extensive quality testing procedures and experimental results. This book discusses every aspect of the model in detail, and hence will be of significant use for the industry and academia. Those working in the semiconductor industry often run into a variety of problems like model non-convergence or non-physical simulation results. This is largely due to a limited understanding of the internal operations of the model as literature and technical manuals are insufficient. This also creates huge difficulty in developing their own IP models. Similarly, circuit designers and researcher across the globe need to know new features available to them so that the circuits can be more efficiently designed.

General

Imprint: Woodhead Publishing Ltd
Country of origin: United States
Series: Woodhead Publishing Series in Electronic and Optical Materials
Release date: June 2023
First published: 2023
Authors: Chenming Hu • Harshit Agarwal • Chetan Gupta • Yogesh Singh Chauhan
Dimensions: 229 x 152mm (L x W)
Format: Paperback
Pages: 325
ISBN-13: 978-0-323-85677-5
Categories: Books > Professional & Technical > Mechanical engineering & materials > Materials science > General
Books > Professional & Technical > Mechanical engineering & materials > Engineering skills & trades > General
Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Electronic devices & materials > General
LSN: 0-323-85677-2
Barcode: 9780323856775

Is the information for this product incomplete, wrong or inappropriate? Let us know about it.

Does this product have an incorrect or missing image? Send us a new image.

Is this product missing categories? Add more categories.

Review This Product

No reviews yet - be the first to create one!

You might also like..

Electrotechnics N4 Student Book
F.O. O'Connell Paperback R372 R330 Discovery Miles 3 300
FET College Series Welding Level 2…
A. Sololo, J. Els, … Paperback R489 R431 Discovery Miles 4 310
Welding For Dummies, 2nd Edition
SR Farnsworth Paperback R511 Discovery Miles 5 110
Welding - Principles and Applications
Larry Jeffus Hardcover R1,558 R1,349 Discovery Miles 13 490
After Slavery - Emancipation and its…
Howard Temperley Hardcover R3,111 Discovery Miles 31 110
Machine Woodworking
Nick Rudkin Paperback R1,494 Discovery Miles 14 940
Engineering Technologies - Level 2
Mike Tooley Paperback R1,206 Discovery Miles 12 060
Hot Rolling of Steel
William L. Roberts Hardcover R12,185 Discovery Miles 121 850
Power Electronics Applied to Industrial…
Nicolas Patin Hardcover R1,995 Discovery Miles 19 950
Cold Rolling of Steel
Roberts Hardcover R12,154 Discovery Miles 121 540
The Welding Engineer's Guide to Fracture…
Philippa Moore, Geoff Booth Hardcover R3,961 Discovery Miles 39 610
Handbook of Laser Welding Technologies
Seiji Katayama Hardcover R5,887 Discovery Miles 58 870

See more

Partners