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Yield Simulation for Integrated Circuits (Paperback, Softcover reprint of hardcover 1st ed. 1987) Loot Price: R4,328
Discovery Miles 43 280
Yield Simulation for Integrated Circuits (Paperback, Softcover reprint of hardcover 1st ed. 1987): D.M. Walker

Yield Simulation for Integrated Circuits (Paperback, Softcover reprint of hardcover 1st ed. 1987)

D.M. Walker

Series: The Springer International Series in Engineering and Computer Science, 33

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Loot Price R4,328 Discovery Miles 43 280 | Repayment Terms: R406 pm x 12*

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In the summer of 1981 I was asked to consider the possibility of manufacturing a 600,000 transistor microprocessor in 1985. It was clear that the technology would only be capable of manufacturing 100,000-200,000 transistor chips with acceptable yields. The control store ROM occupied approximately half of the chip area, so I considered adding spare rows and columns to increase ROM yield. Laser-programmed polysilicon fuses would be used to switch between good and bad circuits. Since only half the chip area would have redundancy, I was concerned that the increase in yield would not outweigh the increased costs of testing and redundancy programming. The fabrication technology did not yet exist, so I was unable to experimentally verify the benefits of redundancy. When the technology did become available, it would be too late in the development schedule to spend time running test chips. The yield analysis had to be done analytically or by simulation. Analytic yield analysis techniques did not offer sufficient accuracy for dealing with complex structures. The simulation techniques then available were very labor-intensive and seemed more suitable for redundant memories and other very regular structures [Stapper 80J. I wanted a simulator that would allow me to evaluate the yield of arbitrary redundant layouts, hence I termed such a simulator a layout or yield simulator. Since I was unable to convince anyone to build such a simulator for me, I embarked on the research myself.

General

Imprint: Springer-Verlag New York
Country of origin: United States
Series: The Springer International Series in Engineering and Computer Science, 33
Release date: December 2010
First published: 1987
Authors: D.M. Walker
Dimensions: 235 x 155 x 12mm (L x W x T)
Format: Paperback
Pages: 209
Edition: Softcover reprint of hardcover 1st ed. 1987
ISBN-13: 978-1-4419-5201-1
Categories: Books > Professional & Technical > Technology: general issues > Technical design > Computer aided design (CAD)
Books > Professional & Technical > Energy technology & engineering > Electrical engineering > General
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LSN: 1-4419-5201-2
Barcode: 9781441952011

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