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Books > Professional & Technical > Technology: general issues > Nanotechnology

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Materials for Advanced Packaging (Paperback, Softcover reprint of the original 2nd ed. 2017) Loot Price: R6,858

Discovery Miles 68 580

Repayment Terms: R643 pm x 12*

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Materials for Advanced Packaging (Paperback, Softcover reprint of the original 2nd ed. 2017): Daniel Lu, C.P. Wong

Materials for Advanced Packaging (Paperback, Softcover reprint of the original 2nd ed. 2017)

Daniel Lu, C.P. Wong

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Loot Price R6,858 Discovery Miles 68 580 | Repayment Terms: R643 pm x 12*

Expected to ship within 10 - 15 working days

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Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.

General

Imprint:	Springer International Publishing AG
Country of origin:	Switzerland
Release date:	June 2018
Editors:	Daniel Lu • C.P. Wong
Dimensions:	235 x 155 x 55mm (L x W x T)
Format:	Paperback
Pages:	969
Edition:	Softcover reprint of the original 2nd ed. 2017
ISBN-13:	978-3-319-83209-8
Categories:	Books > Professional & Technical > Technology: general issues > Nanotechnology Books > Professional & Technical > Mechanical engineering & materials > Materials science > General Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Circuits & components Promotions
LSN:	3-319-83209-3
Barcode:	9783319832098