Materials for Advanced Packaging (Paperback, Softcover reprint of the original 2nd ed. 2017)

Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.

General

Imprint:	Springer International Publishing AG
Country of origin:	Switzerland
Release date:	June 2018
Editors:	Daniel Lu • C.P. Wong
Dimensions:	235 x 155 x 55mm (L x W x T)
Format:	Paperback
Pages:	969
Edition:	Softcover reprint of the original 2nd ed. 2017
ISBN-13:	978-3-319-83209-8
Categories:	Books > Professional & Technical > Technology: general issues > Nanotechnology Books > Professional & Technical > Mechanical engineering & materials > Materials science > General Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Circuits & components
LSN:	3-319-83209-3
Barcode:	9783319832098

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