Materials for Advanced Packaging (Hardcover, 2009 ed.)

Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.

General

Imprint:	Springer-Verlag New York
Country of origin:	United States
Release date:	December 2008
First published:	December 2008
Editors:	Daniel Lu • C.P. Wong
Dimensions:	235 x 155 x 44mm (L x W x T)
Format:	Hardcover
Pages:	724
Edition:	2009 ed.
ISBN-13:	978-0-387-78218-8
Categories:	Books > Professional & Technical > Industrial chemistry & manufacturing technologies > General Books > Professional & Technical > Mechanical engineering & materials > Materials science > General
LSN:	0-387-78218-4
Barcode:	9780387782188

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