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Materials for Advanced Packaging (Hardcover, 2009 ed.) Loot Price: R4,813
Discovery Miles 48 130
Materials for Advanced Packaging (Hardcover, 2009 ed.): Daniel Lu, C.P. Wong

Materials for Advanced Packaging (Hardcover, 2009 ed.)

Daniel Lu, C.P. Wong

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Loot Price R4,813 Discovery Miles 48 130 | Repayment Terms: R451 pm x 12*

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Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.

General

Imprint: Springer-Verlag New York
Country of origin: United States
Release date: December 2008
First published: December 2008
Editors: Daniel Lu • C.P. Wong
Dimensions: 235 x 155 x 44mm (L x W x T)
Format: Hardcover
Pages: 724
Edition: 2009 ed.
ISBN-13: 978-0-387-78218-8
Categories: Books > Professional & Technical > Industrial chemistry & manufacturing technologies > General
Books > Professional & Technical > Mechanical engineering & materials > Materials science > General
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LSN: 0-387-78218-4
Barcode: 9780387782188

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