New to this edition: Updated to using OrCAD Release 17.2 and its
new features; Coverage of PSPICE extra features: PSpice Designer,
PSpice Designer Plus, Modelling Application, PSpice Part Search
Symbol Viewer, PSpice Report, Associate PSpice model, New delay
functions for Behavioural Simulation Models, New Models, Support
for negative values in hysteresis voltage and threshold voltage; A
new chapter on PSpice Advanced Analysis Analog Design and
Simulation Using OrCAD Capture and PSpice, Second Edition provides
step-by-step instructions on how to use the Cadence/OrCAD family of
Electronic Design Automation software for analog design and
simulation. The book explains how to enter schematics in Capture,
set up project types, project libraries and prepare circuits for
PSpice simulation. There are chapters on the different analysis
types for DC Bias point, DC sweep, AC frequency sweep, Parametric
analysis, Temperature analysis, Performance Analysis, Noise
analysis, Sensitivity and Monte Carlo simulation. Subsequent
chapters explain how the Stimulus Editor is used to define custom
analog and digital signals, how the Model Editor is used to view
and create new PSpice models and Capture parts and how the Magnetic
Parts Editor is used to design transformers and inductors. Other
chapters include Analog Behaviorial models, Test Benches as well as
how to create hierarchical designs. The book includes the latest
features in the OrCAD 17.2 release and there are exercises with
step by step instructions at the end of each chapter that enables
the reader to progress based upon their experience and knowledge
gained from previous chapters. The author worked for Cadence for
over eight years and supported and delivered OrCAD PSpice training
courses all over Europe. This book has been endorsed by Cadence. In
addition, there are new chapters on the PSpice Advanced Analysis
suite of tools: Sensitivity Analysis, Optimizer, Monte Carlo, and
Smoke Analysis.The chapters show how circuit performance can
effectively be maximised and optimised for variations in component
tolerances, temperature effects, manufacturing yields and component
stress.
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