Electronics are used in a wide range of applications including
computing, communication, biomedical, automotive, military and
aerospace. They must operate in varying temperature and humidity
environments including indoor controlled conditions and outdoor
climate changes. Moisture, ionic contamination, heat, radiation and
mechanical stresses are all highly detrimental to electronic
devices and can lead to device failures. Therefore, it is essential
that the electronic devices be packaged for protection from their
intended environments, as well as to provide handling, assembly,
electrical and thermal considerations.
Currently, more than 99% of microelectronic devices are plastic
encapsulated. Improvements in encapsulant materials, and cost
incentives have stretched the application boundaries for plastic
electronic packages. Many electronic applications that
traditionally used hermetic packages such as military are now using
commercial-off-the-shelf (COTS) plastic packages. Plastic
encapsulation has the advantages of low cost, smaller form factors,
and improved manufacturability.
With recent trends in environmental awareness, new environmentally
friendly or ' green' encapsulant materials (i.e. without brominated
additives) have emerged. Plastic packages are also being considered
for use in extreme high and low temperature electronics. 3-D
packaging and wafer-level-packaging (WLP) require unique
encapsulation techniques. Encapsulant materials are also being
developed for micro-electro-mechanical systems (MEMS), bio-MEMS,
bio-electronics, and organic light-emitting diodes (O-LEDs).
This book offers a comprehensive discussion of encapsulants in
electronic applications. The main emphasis is on the encapsulation
of microelectronic devices; however, the encapsulation of
connectors and transformers is also addressed. This book discusses
2-D and 3-D packaging and encapsulation, encapsulation materials
including environmentally friendly 'green' encapsulants, and the
properties and characterization of encapsulants. Furthermore, this
book provides an extensive discussion on defects and failures
related to encapsulation, how to analyze such defects and failures,
and how to apply quality assurance and qualification process for
encapsulated packages. This book also provides information on the
trends and challenges of encapsulation and microelectronic packages
including application of nanotechnology.
Guidance on the selection and use of encapsulants in the
electronics industry, with a particular focus on
microelectronics
Coverage of environmentally friendly 'green encapsulants'
Practical coverage of faults and defects: how to analyze them and
how to avoid them"
General
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