Thin-Film Capacitors for Packaged Electronics (Hardcover, 2004 ed.)

Thin-Film Capacitors for Packaged Electronics deals with the capacitors of a wanted kind, still needed and capable of keeping pace with the demands posed by ever greater levels of integration. It spans a wide range of topics, from materials properties to limits of what's the best one can achieve in capacitor properties to process modeling to application examples. Some of the topics covered are the following:
-Novel insights into fundamental relationships between dielectric constant and the breakdown field of materials and related capacitance density and breakdown voltage of capacitor structures,
-Electrical characterization techniques for a wide range of frequencies (1 kHz to 20 GHz),
-Process modeling to determine stable operating points,
-Prevention of metal (Cu) diffusion into the dielectric,
-Measurements and modeling of the dielectric micro-roughness.

General

Imprint:	Springer-Verlag New York
Country of origin:	United States
Release date:	November 2003
First published:	2004
Authors:	Jain Pushkar • Eugene J. Rymaszewski
Dimensions:	235 x 155 x 11mm (L x W x T)
Format:	Hardcover
Pages:	158
Edition:	2004 ed.
ISBN-13:	978-1-4020-7705-0
Categories:	Books > Professional & Technical > Mechanical engineering & materials > Materials science > General Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Electronic devices & materials > Semi-conductors & super-conductors
LSN:	1-4020-7705-X
Barcode:	9781402077050

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