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Sensor Technologies for Civil Infrastructures, Volume 2 - Applications in Structural Health Monitoring (Hardcover, New) Loot Price: R5,538
Discovery Miles 55 380
Sensor Technologies for Civil Infrastructures, Volume 2 - Applications in Structural Health Monitoring (Hardcover, New): Jerome...

Sensor Technologies for Civil Infrastructures, Volume 2 - Applications in Structural Health Monitoring (Hardcover, New)

Jerome Peter Lynch, Hoon Sohn, Ming L. Wang

Series: Woodhead Publishing Series in Civil and Structural Engineering

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Loot Price R5,538 Discovery Miles 55 380 | Repayment Terms: R519 pm x 12*

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Sensors are used for civil infrastructure performance assessment and health monitoring, and have evolved significantly through developments in materials and methodologies. "Sensor Technologies for Civil Infrastructure Volume II" provides an overview of sensor data analysis and case studies in assessing and monitoring civil infrastructures.

Partone focuses on sensor data interrogation and decision making, with chapters on data management technologies, data analysis, techniques for damage detection and structural damage detection. Parttwo is made up of case studies in assessing and monitoring specific structures such as bridges, towers, buildings, dams, tunnels, pipelines, and roads.

"Sensor Technologies for Civil Infrastructure" provides a standard reference for structural and civil engineers, electronics engineers, and academics with an interest in the field.
Provides an in-depth examination of sensor data management and analytical techniques for fault detection and localization, looking at prognosis and life-cycle assessmentIncludes case studies in assessing structures such as bridges, buildings, super-tall towers, dams, tunnels, wind turbines, railroad tracks, nuclear power plants, offshore structures, levees, and pipelines"

General

Imprint: Woodhead Publishing Ltd
Country of origin: United Kingdom
Series: Woodhead Publishing Series in Civil and Structural Engineering
Release date: May 2014
First published: 2014
Editors: Jerome Peter Lynch • Hoon Sohn • Ming L. Wang
Dimensions: 238 x 167 x 45mm (L x W x T)
Format: Hardcover
Pages: 738
Edition: New
ISBN-13: 978-1-78242-242-6
Categories: Books > Professional & Technical > Civil engineering, surveying & building > General
Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Electronic devices & materials > General
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LSN: 1-78242-242-0
Barcode: 9781782422426

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