Chiplet Design and Heterogeneous Integration Packaging (Hardcover, 1st ed. 2023)

The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

General

Imprint:	Springer Verlag, Singapore
Country of origin:	Singapore
Release date:	March 2023
First published:	2023
Authors:	John H. Lau
Dimensions:	235 x 155mm (L x W)
Format:	Hardcover
Pages:	525
Edition:	1st ed. 2023
ISBN-13:	978-981-19-9916-1
Categories:	Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Circuits & components Books > Professional & Technical > Industrial chemistry & manufacturing technologies > Other manufacturing technologies > Precision instruments manufacture > General Promotions
LSN:	981-19-9916-3
Barcode:	9789811999161

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