Heterogeneous Integrations (Hardcover, 1st ed. 2019)

Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.

General

Imprint:	Springer Verlag, Singapore
Country of origin:	Singapore
Release date:	April 2019
First published:	2019
Authors:	John H. Lau
Dimensions:	235 x 155mm (L x W)
Format:	Hardcover
Pages:	368
Edition:	1st ed. 2019
ISBN-13:	978-981-13-7223-0
Categories:	Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Circuits & components Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Electronic devices & materials > General Promotions
LSN:	981-13-7223-3
Barcode:	9789811372230

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