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Books > Professional & Technical > Energy technology & engineering > Electrical engineering

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Area Array Package Design (Paperback) Loot Price: R3,921
Discovery Miles 39 210
Area Array Package Design (Paperback): Ken Gilleo

Area Array Package Design (Paperback)

Ken Gilleo

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Loot Price R3,921 Discovery Miles 39 210 | Repayment Terms: R367 pm x 12*

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This engineering reference covers the most important new techniques in electronic packaging: flip chip, BGA, and MEMs. Written by a team of world-class professionals and researchers, Area Array Package Design includes vital information necessary for the design of cutting-edge electronics products.

General

Imprint: McGraw-Hill
Country of origin: United States
Release date: October 2003
First published: October 2003
Authors: Ken Gilleo
Dimensions: 235 x 190 x 12mm (L x W x T)
Format: Paperback - Trade
Pages: 220
ISBN-13: 978-0-07-173773-9
Categories: Books > Professional & Technical > Technology: general issues > Engineering: general
Books > Professional & Technical > Industrial chemistry & manufacturing technologies > General
Books > Professional & Technical > Energy technology & engineering > Electrical engineering > General
Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > General
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LSN: 0-07-173773-1
Barcode: 9780071737739

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