RF and Microwave Microelectronics Packaging II (Paperback, Softcover reprint of the original 1st ed. 2017)

This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to "RF and Microwave Microelectronics Packaging" (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.

General

Imprint:	Springer International Publishing AG
Country of origin:	Switzerland
Release date:	June 2018
First published:	2017
Editors:	Ken Kuang • Rick Sturdivant
Dimensions:	235 x 155 x 10mm (L x W x T)
Format:	Paperback
Pages:	172
Edition:	Softcover reprint of the original 1st ed. 2017
ISBN-13:	978-3-319-84719-1
Categories:	Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Circuits & components Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Microwave technology
LSN:	3-319-84719-8
Barcode:	9783319847191

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