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Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Microwave technology

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RF and Microwave Microelectronics Packaging (Hardcover, 2010 ed.) Loot Price: R4,521

Discovery Miles 45 210

Repayment Terms: R424 pm x 12*

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RF and Microwave Microelectronics Packaging (Hardcover, 2010 ed.): Ken Kuang, Franklin Kim, Sean S. Cahill

RF and Microwave Microelectronics Packaging (Hardcover, 2010 ed.)

Ken Kuang, Franklin Kim, Sean S. Cahill

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Loot Price R4,521 Discovery Miles 45 210 | Repayment Terms: R424 pm x 12*

Expected to ship within 10 - 15 working days

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RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.

General

Imprint:	Springer-Verlag New York
Country of origin:	United States
Release date:	November 2009
First published:	2010
Editors:	Ken Kuang • Franklin Kim • Sean S. Cahill
Dimensions:	235 x 155 x 23mm (L x W x T)
Format:	Hardcover
Pages:	285
Edition:	2010 ed.
ISBN-13:	978-1-4419-0983-1
Categories:	Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Circuits & components Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Microwave technology Promotions
LSN:	1-4419-0983-4
Barcode:	9781441909831