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Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Microwave technology

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RF and Microwave Microelectronics Packaging (Hardcover, 2010 ed.) Loot Price: R4,170
Discovery Miles 41 700
Repayment Terms: R391 pm x 12*
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RF and Microwave Microelectronics Packaging (Hardcover, 2010 ed.): Ken Kuang, Franklin Kim, Sean S. Cahill

RF and Microwave Microelectronics Packaging (Hardcover, 2010 ed.)

Ken Kuang, Franklin Kim, Sean S. Cahill

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Loot Price R4,170 Discovery Miles 41 700 | Repayment Terms: R391 pm x 12*

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RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.

General

Imprint: Springer-Verlag New York
Country of origin: United States
Release date: November 2009
First published: 2010
Editors: Ken Kuang • Franklin Kim • Sean S. Cahill
Dimensions: 235 x 155 x 23mm (L x W x T)
Format: Hardcover
Pages: 285
Edition: 2010 ed.
ISBN-13: 978-1-4419-0983-1
Categories: Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Circuits & components
Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Microwave technology
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LSN: 1-4419-0983-4
Barcode: 9781441909831

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