RF and Microwave Microelectronics Packaging presents the latest
developments in packaging for high-frequency electronics. It will
appeal to practicing engineers in the electronic packaging and
high-frequency electronics fields and to academic researchers
interested in understanding leading issues in the commercial
sector. It covers the latest developments in thermal management,
electrical/RF/thermal-mechanical designs and simulations, packaging
and processing methods as well as other RF/MW packaging-related
fields.
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