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Books > Professional & Technical > Mechanical engineering & materials > Materials science
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Advanced Adhesives in Electronics - Materials, Properties and Applications (Paperback)
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Advanced Adhesives in Electronics - Materials, Properties and Applications (Paperback)
Series: Woodhead Publishing Series in Electronic and Optical Materials
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Adhesives for electronic applications serve important functional
and structural purposes in electronic components and packaging, and
have developed significantly over the last few decades. Advanced
adhesives in electronics reviews recent developments in adhesive
joining technology, processing and properties. The book opens with
an introduction to adhesive joining technology for electronics.
Part one goes on to cover different types of adhesive used in
electronic systems, including thermally conductive adhesives,
isotropic and anisotropic conductive adhesives and underfill
adhesives for flip-chip applications. Part two focuses on the
properties and processing of electronic adhesives, with chapters
covering the structural integrity of metal-polymer adhesive
interfaces, modelling techniques used to assess adhesive properties
and adhesive technology for photonics. With its distinguished
editors and international team of contributors, Advanced adhesives
in electronics is a standard reference for materials scientists,
engineers and chemists using adhesives in electronics, as well as
those with an academic research interest in the field.
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