Circuit designers, packaging engineers, printed board fabricators,
and procurement personnel will find this book's microelectronic
package design-for-reliability guidelines and approaches essential
for achieving their life-cycle, cost-effectiveness, and on-time
delivery goals.
Its uniquely organized, time-phased approach to design,
development, qualification, manufacture, and in-service management
shows you step-by-step how to:
* Define realistic system requirements in terms of mission profile,
operating life, performance expectations, size, weight, and cost
* Define the system usage environment so that all operating,
shipping, and storage conditions, including electrical, thermal,
radiation, and mechanical loads, are assessed using realistic data
* Identify potential failure modes, sites, mechanisms, and
architecture-stress interactions--PLUS appropriate measures you can
take to reduce, eliminate, or accommodate expected failures
* Characterize materials and processes by the key controllable
factors, such as types and levels of defects, variations in
material properties and dimensions, and the manufacturing and
assembly processes involved
* Use experiment, step-stress, and accelerated methods to ensure
optimum design before production begins
Detailed design guidelines for substrate...wire and wire, tape
automated, and flip-chip bonding...element attachment and case,
lead, lead and lid seals--incorporating dimensional and geometric
configurations of package elements, manufacturing and assembly
conditions, materials selection, and loading conditions--round out
this guide's comprehensive coverage. Detailed guidelines for
substrate...wire and wire, tape automated, and flip-chip
bonding...element attachment and case, lead, lead and lid
seals--incorporating dimensional and geometric configurations of
package elements, manufacturing and assembly conditions, materials
selection, and loading conditions--round out this guide's
comprehensive coverage.
of related interest...
PHYSICAL ARCHITECTURE OF VLSI SYSTEMS --Allan D. Kraus, Robert
Hannemann and Michael Pecht
For the professional engineer involved in the design and
manufacture of products containing electronic components, here is a
comprehensive handbook to the theory and methods surrounding the
assembly of microelectronic and electronic components. The book
focuses on computers and consumer electronic products with internal
subsystems that reflect mechanical design constraints, cost
limitations, and aesthetic and ergonomic concerns. Taking a total
system approach to packaging, the book systematically examines:
basic chip and computer architecture; design and layout;
interassembly and interconnections; cooling scheme; materials
selection, including ceramics, glasses, and metals; stress,
vibration, and acoustics; and manufacturing and assembly
technology. 1994 (0-471-53299-1) pp.
SOLDERING PROCESSES AND EQUIPMENT --Michael G. Pecht
This comprehensive, fundamentals first handbook outlines the
soldering methods and techniques used in the manufacture of
microelectronic chips and electronic circuit boards. In a clear,
easy-to-access format, the book discusses: soldering processes and
classification; the material dynamics of heat soldering when
assembling differing materials; wave and reflow soldering;
controlling contamination during manufacturing cleanings;
techniques for assuring reliability and quality control during
manufacturing; rework, repair, and manual assembly; the modern
assembly / repair station; and more. The book also provides clear
guidelines on assembly techniques as well as an appendix of various
solder equipment manufacturers.
1993 (0-471-59167-X) 312 pp.
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