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Circuits and Systems for Wireless Communications (Paperback, Softcover reprint of the original 1st ed. 2000) Loot Price: R4,382
Discovery Miles 43 820
Circuits and Systems for Wireless Communications (Paperback, Softcover reprint of the original 1st ed. 2000): Markus...

Circuits and Systems for Wireless Communications (Paperback, Softcover reprint of the original 1st ed. 2000)

Markus Helfenstein, George S. Moschytz

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Loot Price R4,382 Discovery Miles 43 820 | Repayment Terms: R411 pm x 12*

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Thisbook contains revised contributions byt he speakers oft he 1s t IEEE Workshop on Wireless Communication Circuits andSystems, held in Lucerne, Switzerland, from June 22-24, 1998. The aim oft he workshop was to apply the vast expertise oft he CAS Society in the area of circuit and systemdesign to therapidly growing field of wireless communications. Theworkshop combined presentations by invited experts from academia and industry with panel and informal discussions. The following topics were covered: RFSystemInteg ration (single chip systems, CM OS RF circuits), RFFront End Circuits (CMOS RF oscillators, broadband design techniques), Wideband Conversion for Software Radio (A/D conversion issues, wideband sub sampling, low spurious A/D conversion), Process Technologies for Future RF Systems (Si, SiGe, GaAs, CMOS, packaging technologies), DSPforWireless Communications (DSP algorithms, fixed point systems, DSP for baseband applications), Blind Channel Equalization (adaptive interference suppression, design techniques, channel estimation). The workshop was a great success, with over 130 participants from 19 countries, from the U. S. to Europe and Asia, including a large contingent of participants from industry (60% ). Feedback from the participants showed that the carefully selected combination oftutorial like lectures with lectures onspecialized and advancedtopics was a feature oft he workshop that was particularly a ppreciated. Duet o therelatively strong involvemento findustry - both in theform of lecturers and listeners - a high level ofd i scussion was attained in bothpanel sessions and informal gatherings.

General

Imprint: Springer-Verlag New York
Country of origin: United States
Release date: December 2010
First published: 2000
Editors: Markus Helfenstein • George S. Moschytz
Dimensions: 235 x 155 x 21mm (L x W x T)
Format: Paperback
Pages: 388
Edition: Softcover reprint of the original 1st ed. 2000
ISBN-13: 978-1-4419-4959-2
Categories: Books > Professional & Technical > Energy technology & engineering > Electrical engineering > General
Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Circuits & components
Books > Professional & Technical > Electronics & communications engineering > Communications engineering / telecommunications > General
Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Applied optics > General
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LSN: 1-4419-4959-3
Barcode: 9781441949592

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