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Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Electronic devices & materials

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Dynamic RAM - Technology Advancements (Hardcover, New) Loot Price: R6,337
Discovery Miles 63 370
Dynamic RAM - Technology Advancements (Hardcover, New): Muzaffer A. Siddiqi

Dynamic RAM - Technology Advancements (Hardcover, New)

Muzaffer A. Siddiqi

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Loot Price R6,337 Discovery Miles 63 370 | Repayment Terms: R594 pm x 12*

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Because of their widespread use in mainframes, PCs, and mobile audio and video devices, DRAMs are being manufactured in ever increasing volume, both in stand-alone and in embedded form as part of a system on chip. Due to the optimum design of their components-access transistor, storage capacitor, and peripherals-DRAMs are the cheapest and densest semiconductor memory currently available. As a result, most of DRAM structure research and development focuses on the technology used for its constituent components and their interconnections. However, only a few books are available on semiconductor memories in general and fewer on DRAMs. Dynamic RAM: Technology Advancements provides a holistic view of the DRAM technology with a systematic description of the advancements in the field since the 1970s, and an analysis of future challenges. Topics Include: DRAM cells of all types, including planar, three-dimensional (3-D) trench or stacked, COB or CUB, vertical, and mechanically robust cells using advanced transistors and storage capacitors Advancements in transistor technology for the RCAT, SCAT, FinFET, BT FinFET, Saddle and advanced recess type, and storage capacitor realizations How sub 100 nm trench DRAM technologies and sub 50 nm stacked DRAM technologies and related topics may lead to new research Various types of leakages and power consumption reduction methods in active and sleep mode Various types of SAs and yield enhancement techniques employing ECC and redundancy A worthwhile addition to semiconductor memory research, academicians and researchers interested in the design and optimization of high-density and cost-efficient DRAMs may also find it useful as part of a graduate-level course.

General

Imprint: Crc Press
Country of origin: United States
Release date: December 2012
First published: 2012
Authors: Muzaffer A. Siddiqi
Dimensions: 234 x 156 x 21mm (L x W x T)
Format: Hardcover
Pages: 382
Edition: New
ISBN-13: 978-1-4398-9373-9
Categories: Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Electronic devices & materials > General
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LSN: 1-4398-9373-X
Barcode: 9781439893739

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