Handbook of 3D Integration - 3D Process Technology V 3 (Hardcover)

Edited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book covers the intricate details of 3D process technology. As such, the main focus is on silicon via formation, bonding and debonding, thinning, via reveal and backside processing, both from a technological and a materials science perspective. The last part of the book is concerned with assessing and enhancing the reliability of the 3D integrated devices, which is a prerequisite for the large-scale implementation of this emerging technology. Invaluable reading for materials scientists, semiconductor physicists, and those working in the semiconductor industry, as well as IT and electrical engineers.

General

Imprint:	Wiley-VCH Verlag GmbH
Country of origin:	Germany
Release date:	June 2014
First published:	July 2014
Authors:	P. Garrou
Dimensions:	248 x 174 x 29mm (L x W x T)
Format:	Hardcover
Pages:	474
ISBN-13:	978-3-527-33466-7
Categories:	Books > Professional & Technical > Mechanical engineering & materials > Materials science > General Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Circuits & components Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Electronic devices & materials > Semi-conductors & super-conductors Promotions
LSN:	3-527-33466-1
Barcode:	9783527334667

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