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Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Electronic devices & materials
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Electronic Packaging for High Reliability, Low Cost Electronics (Hardcover, 1998 ed.)
Loot Price: R4,326
Discovery Miles 43 260
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Electronic Packaging for High Reliability, Low Cost Electronics (Hardcover, 1998 ed.)
Series: NATO Science Partnership Subseries: 3, 57
Expected to ship within 12 - 17 working days
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Integrated circuits are expected to increase their speed and power
dramatically and rapidly. New packaging techniques are required if
the devices are to remain within cost and size constraints. The
present volume addresses new hermetic packaging, new materials for
thermal management and assembly, and new components that integrate
multiple functions (embedded substrates and component arrays),
while retaining previous high levels of reliability. The book
embraces many developments in fundamental materials science and
manufacturing processes of discrete components, as well as
developments in high speed, high integration packaging and more
complex embedded component technologies.
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