Electronic Packaging for High Reliability, Low Cost Electronics (Hardcover, 1998 ed.)

Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The book embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as developments in high speed, high integration packaging and more complex embedded component technologies.

General

Imprint:	Springer
Country of origin:	Netherlands
Series:	NATO Science Partnership Subseries: 3, 57
Release date:	February 2000
First published:	1998
Editors:	R. R. Tummala • Marija Kosec • W.K. Jones • Darko Belavic
Dimensions:	235 x 155 x 19mm (L x W x T)
Format:	Hardcover
Pages:	296
Edition:	1998 ed.
ISBN-13:	978-0-7923-5218-1
Categories:	Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Electronic devices & materials > General
LSN:	0-7923-5218-1
Barcode:	9780792352181

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