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Design for High Performance, Low Power, and Reliable 3D Integrated Circuits (Hardcover, 2012)
Loot Price: R6,580
Discovery Miles 65 800
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Design for High Performance, Low Power, and Reliable 3D Integrated Circuits (Hardcover, 2012)
Expected to ship within 10 - 15 working days
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This book provides readers with a variety of algorithms and
software tools, dedicated to the physical design of
through-silicon-via (TSV) based, three-dimensional integrated
circuits. It describes numerous "manufacturing-ready" GDSII-level
layouts of TSV-based 3D ICs developed with the tools covered in the
book. This book will also feature sign-off level analysis of
timing, power, signal integrity, and thermal analysis for 3D IC
designs. Full details of the related algorithms will be provided so
that the readers will be able not only to grasp the core mechanics
of the physical design tools, but also to be able to reproduce and
improve upon the results themselves. This book will also offer
various design-for-manufacturability (DFM), design-for-reliability
(DFR), and design-for-testability (DFT) techniques that are
considered critical to the physical design process.
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