Design for High Performance, Low Power, and Reliable 3D Integrated Circuits (Hardcover, 2012)

This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It describes numerous "manufacturing-ready" GDSII-level layouts of TSV-based 3D ICs developed with the tools covered in the book. This book will also feature sign-off level analysis of timing, power, signal integrity, and thermal analysis for 3D IC designs. Full details of the related algorithms will be provided so that the readers will be able not only to grasp the core mechanics of the physical design tools, but also to be able to reproduce and improve upon the results themselves. This book will also offer various design-for-manufacturability (DFM), design-for-reliability (DFR), and design-for-testability (DFT) techniques that are considered critical to the physical design process.

General

Imprint:	Springer-Verlag New York
Country of origin:	United States
Release date:	November 2012
First published:	2013
Authors:	Sung Kyu Lim
Dimensions:	235 x 155 x 37mm (L x W x T)
Format:	Hardcover
Pages:	560
Edition:	2012
ISBN-13:	978-1-4419-9541-4
Categories:	Books > Professional & Technical > Electronics & communications engineering > Electronics engineering > Circuits & components Books > Professional & Technical > Industrial chemistry & manufacturing technologies > Other manufacturing technologies > Precision instruments manufacture > General
LSN:	1-4419-9541-2
Barcode:	9781441995414

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